Special Session – Low cost seismic isolation for the developing world
Principal Professor, Department of Engineering, Pontificia Universidad Católica del Perú, Peru
Associate Professor, Structural Engineering, Mechanics and Materials, UC Berkeley, USA
Assistant Professor & Chair of Seismic Design and Analysis, Institute of Structural Engineering, ETH Zurich, Switzerland
The Mw=7.0 Haiti Earthquake (2010) led to 300,000 fatalities, while the Mw=6.9 Loma Prieta, USA (1989) to 63. This and numerous other examples highlight that even though earthquakes are a global phenomenon, their impact in terms of fatalities is tremendously disproportionate, with most deaths being concentrated in the developing world. The main reason is that earthquake-resistant methods developed in the developed world are highly cost-prohibitive in low-income regions. Therefore, there is an urgent need for methods tailored to the financial resources of the non-privileged.
Seismic isolation is considered an expensive method and has been mainly applied in high-income countries. However, there have been numerous research attempts to drastically reduce its cost and make it affordable and widely applicable to low-income countries.
This session aims at bringing together researchers and engineers from both high and low income countries and has two goals: a) Discussion of the state of the art in research on low-cost seismic isolation, and b) Interaction with practicing engineers.
To this end, the contributions that will be accepted from countries coming from low-income¹ countries will be published for free in the conference proceedings. The session will be hybrid and will be held both in person and on-line. On-line participation will be for free for participants coming from low-income countries.
Manuscript Submission : Closed
Contributions to the Special Session should only be submitted online at https://iconhic.com/2021/authors-area/#submissions. When filling the form don’t forget to select the name of the Special Session in the dropdown menu ‘Abstract Topic’.